Methods of forming fine patterns in semiconductor devices

ABSTRACT

Methods of forming a semiconductor device may include providing a feature layer having a first region and a second region. The methods may also include forming a dual mask layer on the feature layer. The methods may further include forming a variable mask layer on the dual mask layer. The methods may additionally include forming a first structure on the feature layer in the first region and a second structure on the feature layer in the second region by patterning the variable mask layer and the dual mask layer. The methods may also include forming a first spacer on a sidewall of the first structure and a second spacer on a sidewall of the second structure. The methods may further include removing the first structure while maintaining at least a portion of the second structure.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a continuation of and claims priority fromU.S. patent application Ser. No. 12/428,963, filed on Apr. 23, 2009 nowU.S. Pat. No. 8,110,506, which claims priority under 35 U.S.C. §119 toKorean Patent Application No. 10-2008-0078519, filed in the KoreanIntellectual Property Office on Aug. 27, 2008, the disclosures of whichare hereby incorporated by reference herein in their entireties. Thisapplication is also related to U.S. patent application Ser. No.12/418,023, filed Apr. 3, 2009.

FIELD

The present inventive concept relates to the field of semiconductors ingeneral, and more particularly, to method of forming semiconductordevices.

BACKGROUND

As semiconductor devices have become more highly integrated, the size offeatures in the semiconductor devices and the spacings therebetween havebeen reduced. One of the ways that these semiconductor devices have beenmore highly integrated is through the use of a photolithography processsometimes referred to as self-aligned reverse patterning. According toself-aligned reverse patterning approach, a pattern can be formed on alayer in which features (a feature layer) are to be formed. A conformallayer can be formed on the pattern and subsequently removed from thefeature layer and the pattern, except that portions of the spacer layercan remain on side walls of the pattern. Then, the pattern can beremoved from the feature layer while the portions of the conformal layerremaining on the side walls remain. The remaining portions of theconformal layer can define a mask pattern that can be used to etch areverse pattern into the feature layer.

SUMMARY

Embodiments according to the inventive concept, a method of formingpatterns in a semiconductor device can include simultaneously forming aplurality of patterns, each including respective features havingdifferent widths by etching a feature layer using first multiple spacerswith a void therebetween and using second multiple spacers with astructure therebetween.

Still further, in some embodiments according to the inventive concept,one of the mask patterns can be formed by removing structures that haveside wall spacers formed thereon in one area of the device, whereas asecond area of the device includes a structure that is maintainedbetween the sidewall spacers. Accordingly, maintaining the structure inthe second area region of the chip and removing the structure in thefirst region can help to provide the elements having different sizes. Inparticular, in the first region described above, the elements in thecorresponding mask can be defined as the side wall spacers themselves,which are left behind once the structure is removed. Furthermore, theelement in the second region of the chip can include both the side wallspacers as well as the structure maintained therebetween. Accordingly,the different elements included in the different patterns in differentregions of the chip can have different sizes.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a high level block diagram illustrating a system including anon-volatile memory device including a decoder circuit that drives wordlines coupled to a cell array also coupled to a page buffer via bitlinein some embodiments.

FIG. 2 is a plan view of a semiconductor substrate including twoseparate regions (a and b) having respective features formed thereon insome embodiments according to the inventive concept.

FIGS. 3 and 5-11 are cross sectional views illustrating methods ofsimultaneously forming a plurality of mask patterns using self alignedreverse patterning in some embodiments according to the inventiveconcept.

FIG. 4 is a flow chart that illustrates methods of forming the dual masklayer on the feature layer in some embodiments according to theinventive concept.

FIGS. 12-14 are cross sectional views that illustrate the simultaneousformation of a plurality of mask pattern using self aligned reversepatterning in some embodiments according to the inventive concept.

FIG. 15 is a plan view of the semiconductor device where elements shownin region A have a width W5 and they are separated by spacing D5 whereasthe element in region B has a width W6 in some embodiments according tothe inventive concept.

FIGS. 16-21 are cross sectional views that illustrate methods of formingSTI regions in substrate by simultaneously forming a plurality of maskpatterns used in self aligned reverse patterning in some embodimentsaccording to the inventive concept.

FIG. 22 is a plan view that illustrates a device having features formedtherein by simultaneously forming a plurality of mask patterns usingself aligned reverse patterning in some embodiments according to theinventive concept.

FIG. 23 is a cross sectional view illustrating the formation of maskpattern elements comprising opposing side wall spacers in region A and amask pattern including elements sandwiched between opposing side wallspacers having a variable mask pattern formed thereon.

FIG. 24 is a cross sectional view illustrating the formation of STIregions in some embodiments according to the inventive concept.

FIG. 25 is a plan view that illustrates a NAND flash device formed insome embodiments according to the inventive concept.

FIGS. 26-39 are alternating plan and cross sectional views thatillustrate methods of simultaneously forming a plurality of maskpatterns using self aligned reverse patterning in some embodimentsaccording to the inventive concept.

FIG. 40 is a plan view illustrates a semiconductor device includingcontact pads used to connect a plurality of conductive lines shown inFIG. 1-32 to external circuits such as decoders in some embodimentsaccording to the inventive concept.

FIGS. 41-44 are plan views illustrating methods of simultaneouslyforming a plurality of mask patterns using self aligned reversepatterning in some embodiments according to the inventive concept.

FIGS. 45-49 are cross-sectional views illustrating methods ofsimultaneously forming a plurality of mask patterns using self alignedreverse patterning in some embodiments according to the inventiveconcept.

DESCRIPTION OF EMBODIMENTS ACCORDING TO THE INVENTIVE CONCEPT

The present inventive concept now will be described more fullyhereinafter with reference to the accompanying drawings, in whichembodiments of the inventive concept are shown. However, this inventiveconcept should not be construed as limited to the embodiments set forthherein. Rather, these embodiments are provided so that this disclosurewill be thorough and complete, and will fully convey the scope of theinventive concept to those skilled in the art. In the drawings, thethickness of layers and regions may be exaggerated for clarity. Likenumbers refer to like elements throughout. As used herein the term“and/or” includes any and all combinations of one or more of theassociated listed items and may be abbreviated as “/”.

The terminology used herein is for the purpose of describing particularembodiments only and is not intended to be limiting of the inventiveconcept. As used herein, the singular forms “a,” “an” and “the” areintended to include the plural forms as well, unless the context clearlyindicates otherwise. It will be further understood that the terms“comprises,” “comprising,” “having,” “having,” “includes,” and/or“including” when used in this specification, specify the presence ofstated features, regions, steps, operations, elements, and/orcomponents, but do not preclude the presence or addition of one or moreother features, regions, steps, operations, elements, components, and/orgroups thereof.

It will be understood that when an element such as a layer or region isreferred to as being “on” or extending “onto” another element (orvariations thereof), it can be directly on or extend directly onto theother element or intervening elements may also be present. In contrast,when an element is referred to as being “directly on” or extending“directly onto” another element (or variations thereof), there are nointervening elements present. It will also be understood that when anelement is referred to as being “connected” or “coupled” to anotherelement (or variations thereof), it can be directly connected or coupledto the other element or intervening elements may be present. Incontrast, when an element is referred to as being “directly connected”or “directly coupled” to another element (or variations thereof), thereare no intervening elements present.

It will be understood that, although the terms first, second, etc. maybe used herein to describe various elements, components, regions, layersand/or sections, these elements, materials, regions, layers and/orsections should not be limited by these terms. These terms are only usedto distinguish one element, material, region, layer or section fromanother element, material, region, layer or section. Thus, a firstelement, material, region, layer or section discussed below could betermed a second element, material, region, layer or section withoutdeparting from the teachings of the present inventive concept.

Relative terms, such as “lower”, “back”, and “upper” may be used hereinto describe one element's relationship to another element as illustratedin the Figures. It will be understood that relative terms are intendedto encompass different orientations of the device in addition to theorientation depicted in the Figures. For example, if the structure inthe FIG. 1 is turned over, elements described as being on the “backside”of substrate would then be oriented on “upper” surface of the substrate.The exemplary term “upper”, can therefore, encompasses both anorientation of “lower” and “upper,” depending on the particularorientation of the figure. Similarly, if the structure in one of thefigures is turned over, elements described as “below” or “beneath” otherelements would then be oriented “above” the other elements. Theexemplary terms “below” or “beneath” can, therefore, encompass both anorientation of above and below.

Embodiments of the present inventive concept are described herein withreference to cross section and perspective illustrations that areschematic illustrations of idealized embodiments of the presentinventive concept. As such, variations from the shapes of theillustrations as a result, for example, of manufacturing techniquesand/or tolerances, are to be expected. Thus, embodiments of the presentinventive concept should not be construed as limited to the particularshapes of regions illustrated herein but are to include deviations inshapes that result, for example, from manufacturing. For example, aregion illustrated or described as flat may, typically, have roughand/or nonlinear features. Moreover, sharp angles that are illustrated,typically, may be rounded. Thus, the regions illustrated in the figuresare schematic in nature and their shapes are not intended to illustratethe precise shape of a region and are not intended to limit the scope ofthe present inventive concept.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this inventive concept belongs. Itwill be further understood that terms, such as those defined in commonlyused dictionaries, should be interpreted as having a meaning that isconsistent with their meaning in the context of the relevant art and thepresent disclosure, and will not be interpreted in an idealized oroverly formal sense unless expressly so defined herein.

FIG. 1 is a high level block diagram illustrating a system 100 includinga non-volatile memory device 30 including a decoder circuit 34 thatdrives word lines coupled to a cell array 32 also coupled to a pagebuffer 36 via bitlines BL0-m. It will be understood that the decoder 34can be used to address selective memory cells within the array 32 uponwhich data is provided to the page buffer 36 via the bitlines BL0-m.

Further, the decoder 34 can control a bitline selection circuit 38,which can select data provided by the page buffer 36 via a control lineYi. The selected data from the bitline selection circuit 38 can beprovided through a data buffer 42 that operates under the control of acontrol unit 44 also directed by the decoder 34.

The non-volatile memory 30 can be controlled by a memory controllercircuit 20 including ancillary control circuits configured to operatethe non-volatile memory 30 to carry out read and write cycles thereto.The memory controller circuit 20 can also include a buffer memory 22,which can be used to temporarily store data intended to be written tothe non-volatile memory 30 as well as the temporarily stored data readfrom the non-volatile memory 30.

A host system 10 is coupled to the memory controller 20 and can providehigh level control on the memory controller circuit 20 to carry outread/write operations to the non-volatile memory 30. It will beunderstood that embodiments of the inventive concept described hereincan be utilized to provide any of the circuitry shown in FIG. 1 as wellas circuitry not shown.

As described herein below in greater detail, embodiments according tothe inventive concept can provide for the simultaneous formation of aplurality of mask patterns using self aligned reverse patterning wherethe masks patterns include respective mask pattern elements that havedifferent widths. For example, in some embodiments according to theinventive concept, elements having different widths and/or differentspacing therebetween can be formed simultaneously on a feature layer,which is subsequently subject to etching using patterns having differentsize/space elements therein. Accordingly, the simultaneous formation ofthe mask patterns having the different sized elements therein can helpto reduce the number of steps that may otherwise be employed during theprocess of forming the semiconductor device.

Still further, in some embodiments according to the inventive concept,one of the mask patterns can be formed by removing structures that haveside wall spacers formed thereon in one area of the device, whereas asecond area of the device includes a structure that is maintainedbetween the sidewall spacers. Accordingly, maintaining the structure inthe second area region of the chip while removing the structure in thefirst region can help to provide the elements having different sizes. Inparticular, in the first region described above, the elements in thecorresponding mask can be defined as the side wall spacers themselves,which are left behind once the structure is removed. Furthermore, theelement in the second region of the chip can include both the side wallspacers as well as the structure maintained therebetween. Accordingly,the different elements included in the different patterns in differentregions of the chip can have different sizes.

FIG. 2 is a plan view of a semiconductor device including two separateregions (A and B) having respective features formed thereon in someembodiments according to the inventive concept. In particular, region Aof the semiconductor device 200 includes two features 210, wherein eachfeature has a width W1 and the features 210 are separated by a distanceD1. Furthermore, the separate region B of the semiconductor device 200includes a feature 220 that has a width W2 that is different than thewidth W1 of the features 210 in region A.

In some embodiments, the region A can denote, for example, a cell arrayregion of the device wherein the features defined therein can berelatively small. In contrast, the region B can denote, for example, aperipheral core or another portion of the cell array region wherein thefeatures are relatively large compared to those included in region A. Inparticular, features 210 having a width W1 can be relatively smallcompared to feature 220 shown in region B. Furthermore, in someembodiments according to the inventive concept, the spacing between thefeatures 210 in region A can be the same as the width of those featuresor, alternatively, the spacing between the features 210 may be less thanthe width W1 or greater than the width W1. It will be further noted thatthe features 210 and 220 in the different regions may or may not beelectrically connected to one another.

FIG. 3 is a cross sectional view illustrating methods of simultaneouslyforming a plurality of mask patterns using self aligned reversepatterning in some embodiments according to the inventive concept.Preliminary structures 340A and 340B (referred to collectively sometimesherein as 340) are formed on underlying layers in region A and region B,the preliminary structures 340 may be formed by photolithographyprocess, which can include a variable mask layer 330 that is formed on adual mask layer 320, which is in turn formed on a feature layer 310, allof which may be supported by a substrate 300 in both regions A and B ofthe device 200.

It will be understood that the layers shown in FIG. 3 can be formed ofdifferent material depending on the particular type of semiconductordevice being formed. For example, if the preliminary structures 340shown in FIG. 3 are being used to ultimately form conductive structures,such as gate electrodes, the feature layer 310 may be material, such asTaN, TiN, W, WN, HfN, WSi_(x), and combinations thereof. Alternatively,if the features to be formed in the layer 310 are bitlines, the featurelayer 310 may be formed of doped polysilicon, a metal, or a metal alloysuch as tungsten or aluminum. Alternatively, in some embodimentsaccording to the inventive concept, when defining active regions insubstrate 300, the feature layer 310 may be eliminated and thepreliminary structures may be used at least initially to define trenchesin the substrate. As shown in FIG. 3, the preliminary structures 340formed in regions A and B are formed to different widths WD1 and WD3respectively.

Referring still to FIG. 3, the variable mask layer 330 can be formed ofa material that has an etch selectivity relative to the dual mask layer320. For example, in some embodiments according to the inventiveconcept, the variable mask layer 330 can be formed of SiON, SiO₂, Si₃N₄,SiCN, polysilicon, a metal, or an organic material. Further, in someembodiments according to the inventive concept, the preliminarystructures 340 may be formed using a photolithography process.

As briefly described above, the dual mask layer 320 has an etchselectivity relative to the variable mask layer 330. Furthermore, thedual mask layer 320 can be formed of a material that contains silicon,such as SiO₂, Si₃N₄, SiCN and/or polysilicon. In still furtherembodiments according to the inventive concept, the dual mask layer 320may be formed of an amorphous carbon layer or a carbon containing layer.The dual mask layer 320 may be applied to the feature layer 310 by aspin coating or CVD process. A portion of dual mask layer 320 formed inthe region A can be used as a sacrificial layer for forming a pluralityof etch mask patterns having multiplied patterns. A portion of dual masklayer formed in the region B can be a portion of an etch mask forforming final patterns.

In some embodiments according to the inventive concept, when the dualmask layer 320 is formed of a carbon containing material, the dual masklayer may be formed of a hydrocarbon compound that includes an aromaticring or an organic compound that includes a derivative thereof. Forexample, in some embodiments according to the inventive concept, thedual mask layer 320 can include an organic compound having an aromaticring such as phenyl benzene, or naphthalene. In still furtherembodiments according to the inventive concept, the dual mask layer 320may be a layer that has a relatively high carbon level such as about 85%to about 99% by weight based on the total weight of the organiccompound.

FIG. 4 is a flow chart that illustrates methods of forming the dual masklayer on the feature layer 310 in some embodiments according to theinventive concept. According to FIG. 4, an organic compound is spincoated onto the feature layer 310 to a thickness of about 1000 angstromsto about 1500 angstroms (Block 405). The organic compound on the featurelayer 310 is then baked at a temperature of about 150° centigrade to350° centigrade for about 60 seconds to form the dual mask layer 320(Block 410).

A second bake is then performed on the dual mask layer at a temperatureof about 300° to about 550° for about 30 to about 300 seconds in orderto harden the dual mask layer 320, which may help reduce adverse effectson the dual mask layer that may otherwise be caused during subsequentsteps in the fabrication of the semiconductor device when, for example,temperatures in excess of 400° centigrade may be applied to the device.

FIG. 5-11 are cross sectional views that illustrate methods ofsimultaneously forming a plurality of mask patterns using self alignedreverse patterning wherein the mask patterns include elements havingdifferent widths in some embodiments according to the inventive concept.According to FIG. 5, the preliminary structures 340 are used to etch theunderlying variable mask layer 330 to expose portions of the dual masklayer 320. As further shown in FIG. 5, the remaining portions of thevariable mask layer 330A and 330B underlying the preliminary structures340 conform to the profiles of the preliminary structures 340 andtherefore have about the same width WD1 and WD3 respectively. In someembodiments according to the inventive concept, the thickness of thepreliminary structures 340 may be reduced while the etching of thevariable mask layer 330 occurs.

According to FIG. 6, the preliminary structures 340 are removed from theportions of the variable mask layer 330A, 330B so that these remainingportions define variable mask patterns 330A and 330B, which can be usedto etch the underlying dual mask layer 320. The variable mask patterns330A and 330B are consumed at a different rate while etching process toform structure mask patterns 320A-320B is performed. The etching of thedual mask layer 320 is conducted to expose the underlying feature layer310 and to define structure mask patterns 320A-320B from the dual masklayer 320. Furthermore, in some embodiments according to the inventiveconcept, the variable mask pattern 330A-330B remaining on the structuremask patterns 320A-320B allow the etching thereof to be conducted atdifferent rates due to the different widths of the mask patterns inregions A and B.

In particular, because the mask pattern in region A is narrower than themask pattern in region B, a three-dimensional etching effect causes thevariable mask pattern 330A in region A to be etched at a faster ratethan the variable mask pattern 330B in region B. Remaining thickness ofthe variable mask pattern 330A in region A TA1 is lower than remainingthickness of the variable mask pattern 330B in region B TA2.Furthermore, in some embodiments according to the inventive concept, thegreater the difference between WD1 and W3, the greater the differencebetween the respective thicknesses TA1 and TB1.

The three dimensional etching effect is illustrated by the arrowsdesignating different directions a1, b1, c1 and a2, b2, and c2 shown inregions A and B respectively. In particular, the etching carried outalong these different directions can be different due to the differentthicknesses of the mask patterns in regions A and B. Accordingly, thedifferent behavior of the etching in these different regions cancontribute to the rate at which the variable mask pattern is etchedwhile the structure mask patterns 320A and 320B are formed.

According to FIG. 7, a spacer layer 350 is conformally deposited on thestructure mask patterns 320A and 320B including on the remnants of thevariable mask patterns 330A and 330B found in regions A and Brespectively. In some embodiments according to the inventive concept,the thickness of the spacer layer 350 may be about equal to thethickness of the structure mask pattern 320A shown in region A. In otherembodiments according to the inventive concept, the thickness of thespacer layer 350 is greater than or less than the thickness of thestructure pattern 320A. In still other embodiments according to theinventive concept, the variable mask pattern 330A is completely removedduring the etching of the dual mask layer to form the structure pattern320A. Accordingly, in such embodiments according to the inventiveconcept, the spacer layer 350 may directly contact the structure pattern320A.

According to FIG. 8, a portion of the spacer layer 350 is removed fromthe feature layer 310 as well as from the variable mask patterns 330Aand 330B. However, as shown in FIG. 8, a portion of the spacer layerremains on the structure mask patterns 320A and 320B and, particularly,on side walls thereof to provide opposing side wall spacers 350A and350B on structure mask patterns 320A and 320B respectively.

As further shown in FIG. 8, the opposing side wall spacers 350B onstructure pattern 320B fully covers side walls of the structure maskpattern 320B and extends above the structure mask pattern 320B tocontact the portion of the variable mask pattern 330B thereon. In someembodiments according to the inventive concept, the spacer layer 350 ispartially removed during an etch back process wherein etching rate inregion A is greater than that in region B, which can be promoted by theportion C1 of the spacer layer 350 shown in FIG. 7. In particular, theslope of portion C1 can be relatively great so that the etching thereofcan be accelerated relative to that found in region B. Accordingly, aportion of the side wall on the structure pattern 320A is exposed due tothe accelerated etching rate in region A.

As shown in FIG. 8, the exposure of the side wall of the structure maskpattern 320A can be by about the distance DA1. Furthermore, thethickness TA2 of the remaining portion of the variable mask pattern 330Acan be further reduced relative to the thickness TB2 of the variablemask pattern 330B due to the slope of the sidewall spacer layer portionC1 as described above in reference to FIG. 7. Furthermore, in someembodiments according to the inventive concept, because of the differentetching rates in regions A and B, the height H1 of the opposing sidewall spacers 350A can be less than the height H2 of the opposing sidewall spacers 350B.

In some embodiments according to the inventive concept, during the etchback process of the spacer layer 350, polymer byproducts can be producedand deposited as layer 354 on the variable mask pattern 330B and on theopposing side wall spacers 350B. In other embodiments according to theinventive concept, the polymer byproduct layer 354 may be reduced oreven eliminated based on the conditions associated with the etch backprocess. In some embodiments according to the inventive concept, theetch back process applied to the spacer layer 350 can be carried outusing a main etching gas of C_(x)F_(y), where x and y are integers 1 and10 respectively. In other embodiments according to the inventiveconcept, the main etching gas can be CH_(x)F_(y) where x and y areintegers 1 and 10 respectively. In some embodiments according to theinventive concept, O2 and Ar may be added to the main etching gas.Accordingly, during the etch back process the polymer byproduct layer354 may be affected by the amount of O2 included in the main etching gasor alternatively, can be affected by the temperature applied during theetch back process. In particular, the polymer byproduct layer 354 may bereduced or even eliminated by decreasing the amount of O2 or by loweringthe process temperature.

According to FIG. 9, the etch back process of the spacer layer 350produces a plurality of self aligned reverse mask pattern defined byelements 320 and corresponding opposing side wall spacers 350 locatedthereon. Moreover, as shown in FIG. 9, a portion of the variable maskpattern 330A is removed from the narrow one of the structure maskpatterns so that the narrow one of the self aligned reverse maskpatterns is exposed on a top surface thereof. Furthermore, the variablemask pattern 330B remains on the wider one of the self aligned reversemask pattern found in region B.

According to FIG. 10, the portion of the self aligned reverse maskpattern 320A in region A is removed from between the opposing side walls350A so that the underlying portion of the feature layer 310 is exposed.Furthermore, the variable mask pattern included as part of the wider oneof the self aligned reverse mask pattern found in region B remainsdespite the removal of element 320A. In particular, the variable maskpattern 330B as well as opposing side wall spacers 350B in region Bprotect the underlying structure 320B from the process used to removethe element 320A. Accordingly, a plurality of self aligned reverse maskpatterns in both region A and region B are simultaneously formed whereina plurality of self aligned reverse mask patterns in region A comprisingspacers 350A and wherein a plurality of self aligned reverse maskpatterns in region B comprising spacers 350B and structure mask patterns320B.

According to FIG. 11, the self aligned reverse mask patterns found inregion A and region B are utilized as a mask to etch the underlyingfeature layer 310 to define features 310A in region A and 310B in regionB. As described above, these features can be any component used in asemiconductor device such as conductive components found in gates andbit lines etc.

FIGS. 12-14 are cross sectional views that illustrate the simultaneousformation of a plurality of mask pattern using self aligned reversepatterning in some embodiments according to the inventive concept.According to FIG. 12, a spacer layer 450 is etched back to provideopposing side wall spacers 450A and 450B. Furthermore, as shown in FIG.12, the opposing side wall spacers 450B located on the structure maskpattern located in region B are etched back to a height H4 above thefeature layer 310 to expose a portion DB2 of a side wall of thestructure 320B. It will be understood that a polymer byproduct layer (asillustrated above, for example in FIG. 8) is not shown in FIG. 12,however, a polymer byproduct layer may in fact be present in someembodiments according to the inventive concept.

According to FIG. 13, the variable mask pattern 330A and 330B are etchedso that the portion of the variable mask pattern 330A located on thestructure in region A is removed whereas the variable mask pattern 330Bon the structure mask pattern in region B remains. In some embodiments,the complete removal of the variable mask layer on the structure inregion A is attributed to the 3-D etching effect described above.

According to FIG. 14, the structure mask pattern in region A is removedby etching so that the opposing side wall spacers 450A remain on thefeature layer 310 in region A. However, as also shown in FIG. 14, thestructure mask pattern 320B located between the opposing side wallspacers 450B substantially remain beneath the variable mask pattern 330Bin region B. It will be understood, however, that because of the exposedportion of the side walls of the structure 320B, a portion of thestructure 320B may in fact be etched during the removal of the structure320A as shown in highlighted portion C5.

Accordingly, the opposing spacers 450A in region A and the opposingspacers 450B and structure mask pattern 320B in region are formedsimultaneously.

FIG. 15 is a plan view of the semiconductor device 500 where elements510 shown in region A have a width W5 and they are separated by spacingD5 whereas the element 520 in region B has a width W6 in someembodiments according to the inventive concept.

FIGS. 16-21 are cross sectional views that illustrate methods of formingSTI (shallow trench isolation) regions in substrate by simultaneouslyforming a plurality of mask patterns used in self aligned reversepatterning in some embodiments according to the inventive concept.According to FIG. 16, a preliminary pattern including elements 340A and340B collectively referred to as 340 is formed on a variable mask layer330, which is formed on a dual mask layer 320 formed on a buffer masklayer 610 that is formed on a hard mask layer 604 on a pad oxide layer602 all of which is located on the substrate 600.

It will be understood that the hard mask layer 604 can include a singlelayer that includes only one material or may include multiple layerscomprising two or more material layers. In still further embodimentsaccording to the inventive concept, the buffer mask layer 610 can havean etch selectivity relative to the hard mask layer 604. In someembodiments according to the inventive concept, the buffer mask layer610 can be omitted.

According to FIG. 17, mask patterns are formed on region A and region Bincluding mask elements 350A and 350B and 320B respectively. Inparticular, the elements of the mask pattern in region A include sidewall spacers 350A that can be formed as described above in reference toFIGS. 1-14. Still further, the mask pattern comprising opposing sidewall spacers 350B and a structure mask pattern 320B and a variable masklayer 330B thereon is formed in the region B to have a different width(W6) all of which is located on the buffer mask layer 610. Stillfurther, the opposing side wall spacers 350A shown in region A have awidth W5 and are spaced apart by a distance W5. In other words, thespacing between pairs of opposing side wall spacers and the spacingbetween the opposing side wall spacers themselves is equal. As furthershown in FIG. 17, a width of the element of the mask pattern in region Bis shown to be W6.

According to FIG. 18, the elements in the mask patterns in regions A andB are used as etch masks to form buffer mask patterns 610A and 610B inregions A and B respectively. According to FIG. 18, a width of thebuffer mask pattern 610 formed in region A is W5 and the width of thebuffer mask pattern 610B formed in region B is W6.

According to FIG. 19, the buffer mask pattern 610A and 610B are used toetch the hard mask layer 604 to provide a hard mask pattern 604A inregion A and a hard mask pattern 604B in region B, beneath whichportions of the pad oxide layer 602 are exposed.

According to FIG. 20, the hard mask pattern 604A and 604B are used as anetch mask to etch through the exposed portions of the pad oxide layer602 and into the substrate 600 to form trenches 670A in region A and670B in region B.

According to FIG. 21, an oxide material is formed in the trenches 670Aand 670B to form STI regions 672A and 672B in regions A and Brespectively. Furthermore, active regions 674A and 6748 are definedbetween immediately adjacent shallow trench isolation regions 672A and672B each of which can have the width W5 and W6 respectively as shown.Furthermore, the pitch between the adjacent act of areas can be P asshown.

FIG. 22 is a plan view that illustrates a device having features formedtherein by simultaneously forming a plurality of mask patterns usingself aligned reverse patterning in some embodiments according to theinventive concept. In particular, FIG. 22 illustrates embodiments wherethe spacing between elements included in the pair thereof was greaterthan spacing between adjacent pairs of those elements. For example, asshown in FIG. 22, spacing SD1 shown separating one pair of features 510Cis greater than a spacing SD2 separating that pair with the immediatelyadjacent pair features.

FIG. 23 is a cross sectional view illustrating the formation of maskpattern elements comprising opposing side wall spacers 350C in region Aand a mask pattern including elements 320B sandwiched between opposingside wall spacers 350D having a variable mask pattern 330B formedthereon. As described above in reference to FIG. 20, the trenches 670Care formed in the substrate by using the elements 350C and elements 320Band 320D in region B as an etching mask. Furthermore, in someembodiments according to the inventive concept, because of the differentspacing between individual elements in a pair and the spacing betweenthe pairs themselves, the trenches 670C can be formed to differentdepths. For example, as shown in FIG. 24, spacing SD1 associated withthe spacing between an opposing pair of side wall spacers 350C shown inFIG. 23 provides the formation of a trench 670C to a depth TD1 beneaththe pad oxide layer 602. In contrast, the trench 670C formed by thecorresponding elements that are spaced together by distance SD2 (i.e.,the spacing between opposing pair of side wall spacers 350C) providesfor the formation of a trench to a depth TD2, which is less than TD1. Itwill be understood that, TD3 in the region B may depend on the distancesfrom 604D to a neighboring pattern thereof.

FIG. 25 is a plan view that illustrates a NAND flash device formed insome embodiments according to the inventive concept. Furthermore, ahighlighted portion 2500 includes various cross sectional viewsillustrated in subsequent figures in some embodiments according to theinventive concept. Still referring to FIG. 25, the NAND device 700includes a cell array region 700A including NAND flash type cells. Theregion 700B corresponds to a contact region for the NAND flash device.The region 700C corresponds to a peripheral region of the flash typedevice. Further, the regions 740 corresponds to a cell block regionwherein elements 701-732 correspond to a plurality of conductive lines.The regions 750 corresponds to dummy conductive lines such as wordlines, bit lines or medal lines in some embodiments according to theinventive concept. Element 722 corresponds to conductive patterns for aperipheral circuit in some embodiments according to the inventiveconcept. Region 700B corresponds to a region used to connect conductivelines 701-732 to external circuits such as decoders in some embodimentsaccording to the inventive concept.

FIGS. 26-39 are alternating plan and cross sectional views thatillustrate methods of simultaneously forming a plurality of maskpatterns using self aligned reverse patterning in some embodimentsaccording to the inventive concept. In particular, element 800corresponds to a substrate on which the flash memory devices can beformed, element 830 corresponds to conductive layer to which may beformed of materials TaN, TiN, W, N, HfN, WSi_(x) or in combinationsthereof. In some embodiments according to the inventive concept, theelements 830 can comprise bitlines and may be formed of polysilicon,metal, and/or metal alloys. Element 832 corresponds to a hard mask layerand may be either a single layer comprising one material or multiplelayers each comprising separate material layers. Element 834 cancomprise a buffer mask layer having enough selectivity relative to thehard mask layer 832. Element 320 corresponds to a dual mask layer,element 330 corresponds to a variable mask layer, and element 340 (340Aand 340B) corresponds to a mask pattern in some embodiments according tothe inventive concept.

According to FIG. 27, a plurality of preliminary patterns are formed onthe variable mask layer 330 having different spacings and widths. Forexample, the spacing between elements 340 in the preliminary patternillustrated by cross section 8A-8A′ can be 2PC with the width of WD3whereas a width of the elements shown by cross section 8C-8C′ is W12,and further, the width of element 340B shown according to cross section8D-8D′ is W13.

According to FIGS. 28 and 29, a plurality of mask patterns are formed inthe different regions of the device using self aligned reversepatterning so that elements therein have different widths in someembodiments according to the inventive concept. In particular, opposingside wall spacers 350A and 350B are formed in different regions of thesubstrate where opposing side wall spacers 350A shown according to crosssections 8A-8A′ and 8B-8B′ have a different width than those shownaccording to cross sections 8C-8C′ and 8D-8D′.

According to FIGS. 30 and 31 a separation mask pattern 870 is formedover the mask patterns and is patterned to partially expose, forexample, the portions of the opposing side wall spacers 350A and formedlooped-shaped spacers 350A. It will be understood that in someembodiments according to the inventive concept the separation maskpattern 870 can be a photoresist material.

According to FIGS. 32 and 33, exposed portions of the side wall spacers350A shown in FIG. 30 are removed (sometimes referred to as trimmed) toseparate a portion of the looped-shaped spacers 350A from one another todefine two separate spacers as shown in FIG. 32 for example. Accordingto FIGS. 34 and 35, the elements 350A/350B/320B in the mask patterns areused to etch the underlying buffer mask layer 834 to define features834A/834B as shown.

According to FIGS. 36 and 37, the features 834A/834B are used as a maskto form a reverse pattern 832A-832B on the conductive line layer 830.According to FIGS. 38 and 39, the conductive line layer 830 is etchedusing the reverse pattern 832A/832B to form conductive line patterns830A/830B on the substrate 800.

FIG. 40 is a plan view illustrates a semiconductor device 900 includingcontact pads 752 used to connect a plurality of conductive lines shownin 1-32 to external circuits such as decoders in some embodimentsaccording to the inventive concept. According to FIGS. 41 and 42, aprocess such as that described above in reference to FIGS. 32 and 33 iscarried out to provide the structure shown. Furthermore, a local maskpattern 920, such as a photoresist pattern is formed on the structuresshown in FIGS. 32 and 33 and the buffer mask layer 834 is etched usingelements 350A, 350B, 920 and 320B as an etch mask to form elements in834C and 834D as shown. According to FIG. 43, element 832 is etchedusing 834C and 834D as an etch mask to form elements 832C and 832D asshown. According to FIG. 44, element 830 is etched using 832C and 832Das an etch mask to form 830C and 830D.

According to FIG. 45, the structures shown therein are analogous tothose described above in reference to FIG. 25 corresponding to crosssections 8A-8A′, 8B-8B′, 8C-8C′, and 8D-8D′ in some embodimentsaccording to the inventive concept. According to FIG. 45, elements 350Eand 350F (corresponding to the opposing side wall spacers providingelements of the mask patterns) are similar elements 350A and 350B shownin FIGS. 28 and 29. However, in contrast to the elements shown in FIGS.28 and 29, the widths W8E corresponding to element 350E and W10Fcorresponding to element 350F are greater than the corresponding widthsshown in FIGS. 28 and 29. Accordingly, the elements 350E in the maskpatterns shown in FIG. 45 are spaced apart from one another such thatelements within each pair of the opposing side wall spacers 350E areseparated by first spacing immediately adjacent pairs of opposing sidewall spacers 350E are separated by a different spacing SD4, which isless than SD3. In other embodiments according to the inventive concept,structures may be formed such that SD3 is less than SD4.

According to FIG. 46, elements 834 and 832 are etched in a manneranalogous to that described above in reference to FIGS. 32-35 usingelements 350E, 350F, and 320B as an etch mask to form elements 832E and832F to provide a hard mask patterns 832E and 832F. According to FIG.47, element 830 is etched using 832E and 832F as a mask to form element830E.

FIG. 48 is a cross sectional view of a NAND type flash memory deviceformed in some embodiments according to the inventive concept. Accordingto FIG. 48, a floating type NAND flash memory device includes theplurality of conductive patterns 830E providing word lines for the NANDflash memory device. An element 802 provides a tunneling oxide layer, anelement 830_FG can provide a floating gate structure, element 830_IG canprovide an intricate dielectric layer. Further, and element 830_CG canprovide a control gate. In some embodiments according to the inventiveconcept, the spacing between the elements in the conductive pattern canalternate according to different spacings SD3 and SD4. Furthermore, theprofiles of side walls associated with these conductive patterns can beeither slopped or substantially vertical.

According to FIG. 21E, the charge trap floating type NAND device isshown in some embodiments according to the inventive concept. Inparticular, a plurality of conductive lines can be provided according toa pattern 830E to provide word lines to the NAND type flash memorydevice. Furthermore, element 804 can provide a tunneling oxide layer,and 830_CT can provide a charge trap layer. In some embodimentsaccording to the inventive concept, the charge trap layer under 830_CTcan be a high-K film such as Si3N4, a metal oxide, a metal nitride, or acombination thereof. A blocking insulation layer 830_BI can comprise amaterial, such as Al₂O₃, SiO₂, HfO₂, ZrO₂, LaO, LaAlO, LaHfO and/orHfAlO. In element 830_GE can provide a gate electrode wherein the gateelectrode material can comprise TaN, W, WN, HfN, WSix, or in combinationthereof. As shown in FIG. 49, the spacing between the plurality ofconductive patterns can vary. In particular, spacing between any of theadjacent conductive patterns can be provided as SD3 whereas other onesof the plurality of conductive patterns can be spaced apart by anyamount of SD4, which is less than or greater than SD3. Still further,the vertical side wall profiles of the plurality of conductive patternscan be either vertical or slopped.

As described above, embodiments according to the inventive concept canprovide for the simultaneous formation of a plurality of mask patternsusing self aligned reverse patterning where the masks patterns includerespective mask pattern elements that have different widths. Forexample, in some embodiments according to the inventive concept,elements having different widths and/or different spacing therebetweencan be formed simultaneously on a feature layer, which is subsequentlysubject to etching using patterns having different size/space elementstherein. Accordingly, the simultaneous formation of the mask patternshaving the different sized elements therein can help to reduce thenumber of steps that may otherwise be employed during the process offorming the semiconductor device.

Still further, in some embodiments according to the inventive concept,one of the mask patterns can be formed by removing structures that haveside wall spacers formed thereon in one area of the device, whereas asecond area of the device includes a structure that is maintainedbetween the sidewall spacers. Accordingly, maintaining the structure inthe second area region of the chip while removing the structure in thefirst region can help to provide the elements having different sizes. Inparticular, in the first region described above, the elements in thecorresponding mask can be defined as the side wall spacers themselves,which are left behind once the structure is removed. Furthermore, theelement in the second region of the chip can include both the side wallspacers as well as the structure maintained therebetween. Accordingly,the different elements included in the different patterns in differentregions of the chip can have different sizes.

What is claimed is:
 1. A method of manufacturing a semiconductor device,comprising: providing a feature layer having a first region and a secondregion; forming a dual mask layer on the feature layer; forming avariable mask layer on the dual mask layer; forming a first structure onthe feature layer in the first region and a second structure on thefeature layer in the second region by patterning the variable mask layerand the dual mask layer; forming a first spacer on a sidewall of thefirst structure and a second spacer on a sidewall of the secondstructure; removing the first structure while maintaining at least aportion of the second structure; and simultaneously etching the featurelayer using the first spacer, the second spacer, and the at least aportion of the second structure as an etch mask.
 2. The method of claim1, wherein a width of the second structure is greater than that of thefirst structure.
 3. The method of claim 1, wherein forming the firststructure and the second structure comprises: forming photoresistpatterns on the variable mask layer in the first region and the secondregion; patterning the variable mask layer using the photoresistpatterns as an etch mask to form variable mask patterns; patterning thedual mask layer using the variable mask patterns as an etch mask to formthe first structure in the first region and the second structure in thesecond region.
 4. The method of claim 3, wherein patterning the dualmask layer is performed such that the variable mask patterns in thefirst region are etched away faster than the variable mask pattern inthe second region.
 5. A method of manufacturing a semiconductor device,comprising: providing a substrate having a first region and a secondregion; forming a pad oxide layer on the substrate; forming a hard masklayer on the pad oxide layer; forming a dual mask layer on the hard masklayer; forming a variable mask layer on the dual mask layer; forming afirst structure on the hard mask layer in the first region and a secondstructure on the hard mask layer in the second region by patterning thevariable mask layer and the dual mask layer; forming a first spacer on asidewall of the first structure and a second spacer on a sidewall of thesecond structure; removing the first structure while maintaining atleast a portion of the second structure; simultaneously etching the hardmask layer using the first spacer, the second spacer, and the at least aportion of the second structure as etch masks to form hard maskpatterns; and etching the substrate using the hard mask patterns as etchmasks to form trenches in the first region and the second region.
 6. Themethod of claim 5, wherein the hard mask layer comprises a single layeror multiple layers.
 7. The method of claim 5, wherein the trenches inthe first region comprise a first trench and a second trench, the secondtrench having a depth greater than that of the first trench.
 8. Themethod of claim 7, wherein the first trench and the second trench areformed alternately.
 9. A method of manufacturing a semiconductor device,comprising: providing a conductive layer having a first region and asecond region; forming a hard mask layer on the conductive layer;forming a dual mask layer on the hard mask layer; forming a variablemask layer on the dual mask layer; forming a first structure on the hardmask layer in the first region and a second structure on the hard masklayer in the second region by patterning the variable mask layer and thedual mask layer; forming a first spacer on a sidewall of the firststructure and a second spacer on a sidewall of the second structure;removing the first structure while maintaining at least a portion of thesecond structure; simultaneously etching the hard mask layer usingportions of the first spacer, the second spacer, and the at least aportion of the second structure as etch masks to form hard maskpatterns; and etching the conductive layer using the hard mask patternsas etch masks to form conductive patterns in the first region and thesecond region.
 10. The method of claim 9, wherein spacings between theconductive patterns comprise a first spacing and a second spacing, thesecond spacing being greater than the first spacing.